What factors influence the quality of diamond dicing blades?

To dice, cut, or groove semiconductor wafers, silicon, glass, ceramic, crystal, and many other types of semiconductor-related materials, dicing blades are typically made of synthetic resin, copper, tin, nickel, and other metals as a binder combined with artificial diamond. Related product: Saw Blade.

1. The effect of diamond particle size

(1) Large diamond particles:

A. Due to the large blade edge and the amount of debris removed, the product is not susceptible to silicon powder accumulation and precipitation.

B. The contact surface with the binder is large, resistant to wear, and has a high processing efficiency.

C. The contact surface with the binder is small, has low resistance, is easy to wear, and has low processing efficiency.

(2) Small diamond specks:

A. Limited product contact range, minor debris, and collapse or even no collapse;

B. The blade edge is small, the debris removed is minimal, and the product is simple to silicon powder deposition;

C. The contact surface with the binder is small, has low resistance, is easy to wear, and has low processing efficiency.

2. The effect of blade binder strength

1) High strength binder: high toughness, low breakage, and high utilization rate; high wear resistance, low blade regeneration ability; high resistance, slow feed speed, and low efficiency.

2) Low strength binder: low resistance, fast feed speed, and high efficiency; easy to wear, strong blade regeneration ability, and good product quality; low toughness, easy to break, and low utilization rate.

3. The effect of particle concentration ratios

1) High concentration ratio: many blade edges and removed debris, and the product is difficult to leave silicon powder; small diamond particle load and cutting resistance while fast progress and high efficiency; small blade edge and debris, easy to wash, quality assurance; less binder, low blade toughness, easy to break and scratch the product.

2) Low concentration ratio: more binder and toughness, difficult to break; less blade edge, less removed debris; easy silicon powder residue; high diamond particle load and cutting resistance, slow progress; and low efficiency.

4. The effect of blade thickness

1) Thick Blade: the blade vibration is low and the product quality is guaranteed; the blade strength is strong and not easily broken; the cutting contact area is large, with high resistance to debris; and the feed speed is slow and easily polluted.

2) Thin Blade: small cutting contact area and resistance; fast feed speed; low blade vibration; guaranteed product quality; weak blade strength; easily broken.

5. The effect of blade length

1) Long blade length: long service life; weak blade strength; slow feed speed; easily broken; high vibration; prone to deflection; S-shaped cutting.

2) Short blade length: short service life, high blade strength, fast feed speed, not easily broken; low vibration and easy deflection, good quality.

6. The impact of dicing blade cutting

Blade dicing is used to expose the diamond on the blade surface and correct the eccentricity of the blade, hub, and flange.

Although the new blade is in direct contact with the top of the spindle when installed on the spindle and flange, there is still a gap between them, which is the "eccentricity" of the blade. Grinding the blade not only exposes the diamond better, but it also corrects the "concentricity" of the blade and the tool rest. If the blade is used in the case of "eccentricity," only a portion of the blade works, the load is too great, reverse knife and overload are possible, and product quality suffers.

The above analysis shows that the choice of blades with different formulations has a significant impact on the processing quality and efficiency of products.

How do I select a dicing blade?

Diamond dicing blade made of metal:

Electronic components, optical components, ceramic, sapphire, optical glass, quartz, and BGA / WLSCP packaging are the primary processing materials.

Diamond dicing blade made of resin:

High flexibility and self-sharpening ability

QFN, DFN, optical glass, ceramic, BGA, and gallium arsenide are among the most common uses.